The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 18, 2006
Filed:
Mar. 10, 2004
Jen-lin Chao, Hsinchu, TW;
Chin-yung Chang, Hsinchu, TW;
Jen-Lin Chao, Hsinchu, TW;
Chin-Yung Chang, Hsinchu, TW;
Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;
Abstract
A system and method of coinsurance wafer management. The system includes at least one production line and an order management unit. The production line processes a MPW shuttle including original wafers and coinsurance wafers with a common fabrication process before metal layering, processes the original wafers with different metal layering fabrication processes according to a metal layering technology of each device design of the MPW shuttle, and withholds the coinsurance wafers without further fabrication. The order management unit receives a request for a designated device design before a cutoff date, and the production line releases and processes coinsurance wafers with the metal layering fabrication process corresponding to the designated device design when the request is received.