The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 18, 2006
Filed:
Aug. 14, 2001
Ying MA, Weatherford, TX (US);
William Wojtczak, Austin, TX (US);
Cary Regulski, Sugar Hill, GA (US);
Thomas H. Baum, New Fairfield, CT (US);
David D. Bernhard, Newtown, CT (US);
Deepak Verma, Scottsdale, AZ (US);
Ying Ma, Weatherford, TX (US);
William Wojtczak, Austin, TX (US);
Cary Regulski, Sugar Hill, GA (US);
Thomas H. Baum, New Fairfield, CT (US);
David D. Bernhard, Newtown, CT (US);
Deepak Verma, Scottsdale, AZ (US);
Advanced Technology Materials, Inc., Danbury, CT (US);
Abstract
A chemical mechanical polishing slurry composition and method for using the slurry composition for polishing copper, barrier material and dielectric material that comprises first and second-step slurries. The first-step slurry has a high removal rate on copper and a low removal rate on barrier material. The second-step slurry has a high removal rate on barrier material and a low removal rate on copper and dielectric material. The first slurry comprises at least an organic polymeric abrasive.