The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 14, 2006
Filed:
Oct. 24, 2003
Applicants:
Kiyoshi Ooi, Nagano, JP;
Yasuyoshi Horikawa, Nagano, JP;
Inventors:
Kiyoshi Ooi, Nagano, JP;
Yasuyoshi Horikawa, Nagano, JP;
Assignee:
Shinko Electric Industries Co., Ltd., Nagano, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/8242 (2006.01);
U.S. Cl.
CPC ...
Abstract
A substrate includes a plurality of insulation layers forming a laminated structure and a built-in capacitor formed in the laminated structure, wherein the laminated structure includes a layer of baked organic polysilane.
Ooi, Kiyoshi. (2006). Substrate for carrying a semiconductor chip and a manufacturing method thereof (U.S. Patent No. 6998308). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6998308
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile