The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 07, 2006
Filed:
Mar. 25, 2002
Sang Ho Lee, Seoul, KR;
Jun Young Yang, Seoul, KR;
Seon Goo Lee, Kyonggi-do, KR;
Jong Hae Hyun, Seoul, KR;
Choon Heung Lee, Seoul, KR;
Sang Ho Lee, Seoul, KR;
Jun Young Yang, Seoul, KR;
Seon Goo Lee, Kyonggi-do, KR;
Jong Hae Hyun, Seoul, KR;
Choon Heung Lee, Seoul, KR;
Amkor Technology, Inc., Chandler, AZ (US);
Abstract
A semiconductor package including passive elements and a method of manufacturing provide reduced package size, improved performance and higher process yield by mounting the passive elements beneath the semiconductor die on the substrate. The semiconductor die may be mounted above the passive elements by mechanically bonding the semiconductor die to the passive elements, mounting the passive elements within a recess in the substrate or mounting the semiconductor using an adhesive retaining wall on the substrate that protrudes above and extends around the passive elements. The recess may include an aperture through the substrate to vent the package to the outside environment or may comprise an aperture through the substrate and larger than the semiconductor die, permitting the encapsulation to entirely fill the aperture, covering the die and the passive elements to secure them mechanically within the package.