The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 24, 2006
Filed:
May. 15, 2003
Yoshinori Miyaki, Tachikawa, JP;
Hiromichi Suzuki, Higashiyamato, JP;
Kazunari Suzuki, Tokyo, JP;
Takafumi Nishita, Iruma, JP;
Fujio Ito, Hanno, JP;
Kunihiro Tsubosaki, Hino, JP;
Akihiko Kameoka, Saitama, JP;
Kunihiko Nishi, Kokubunji, JP;
Yoshinori Miyaki, Tachikawa, JP;
Hiromichi Suzuki, Higashiyamato, JP;
Kazunari Suzuki, Tokyo, JP;
Takafumi Nishita, Iruma, JP;
Fujio Ito, Hanno, JP;
Kunihiro Tsubosaki, Hino, JP;
Akihiko Kameoka, Saitama, JP;
Kunihiko Nishi, Kokubunji, JP;
Renesas Technology Corp., Tokyo, JP;
Hitachi ULSI Systems Co., Ltd., Tokyo, JP;
Abstract
The occurrence of a package crack in the back vicinity of a die pad is restrained by making the outward appearance of the die pad of a lead frame smaller than that of a semiconductor chip which is mounted on it, and also the occurrence of a package crack in the main surface vicinity of the semiconductor chip is restrained by forming a layer of organic material with good adhesion property with the resin that constitutes the package body on the final passivation film (final passivation film) that covers the top layer of conductive wirings of the semiconductor chip.