The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 13, 2005
Filed:
May. 19, 2004
Chun-sheng Wang, Jhubei, TW;
Yi-chang Sung, Jhubei, TW;
Chi-hung Liao, Sanchong, TW;
Li-kong Turn, Taichung, TW;
Louie Liu, Hsinchu, TW;
Chun-Sheng Wang, Jhubei, TW;
Yi-Chang Sung, Jhubei, TW;
Chi-Hung Liao, Sanchong, TW;
Li-Kong Turn, Taichung, TW;
Louie Liu, Hsinchu, TW;
Abstract
An improved method of wafer height mapping using a wafer level sensor eliminates or substantially minimizes the 'spacing' in the wafer height mapping data usually caused by having an exposure field on a wafer whose width is less than the width of the measurement spot array of the wafer level sensor and also not being a multiple of the width of a single measurement spot. According to the improved method, the measurement spot array is first translated towards one edge of the exposure field and scanned. Then the measurement spot array is translated towards the other edge of the exposure field and scanned second time to map the area that was missed during the first mapping scan.