The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 13, 2005
Filed:
Aug. 28, 2003
Applicants:
Naoyuki Koizumi, Nagano, JP;
Kei Murayama, Nagano, JP;
Shigeru Mizuno, Nagano, JP;
Takashi Kurihara, Nagano, JP;
Inventors:
Naoyuki Koizumi, Nagano, JP;
Kei Murayama, Nagano, JP;
Shigeru Mizuno, Nagano, JP;
Takashi Kurihara, Nagano, JP;
Assignee:
Shinko Electric Industries Co., Ltd., Nagano, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L021/44 ; H01L021/48 ; H01L021/50 ;
U.S. Cl.
CPC ...
Abstract
In manufacturing a thin semiconductor chip, a wafer is stably held during processing to maintain a stable shape and to avoid generation of cracks on the wafer. When a thin wafer having a surface thereon is to be processed, a rigid support body is adhered to the other surface of the thin wafer and a ring-shaped frame, encircling an outer periphery of the thin wafer, is adhered to the rigid support body.