The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 29, 2005
Filed:
Sep. 01, 2004
Applicants:
Chien-wei Chang, Taoyuan Hsien, TW;
Sheng-chuan Huang, Taoyuan, TW;
Inventors:
Chien-Wei Chang, Taoyuan Hsien, TW;
Sheng-Chuan Huang, Taoyuan, TW;
Assignee:
Kinsus Interconnect Technology, Taoyuan, TW;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L021/44 ;
U.S. Cl.
CPC ...
Abstract
The present invention relates to a Fine Pitch flip chip substrate. A black oxide dam is made on the metal circuit between bump pads to replace the conventional solder resist so that the bump pads will not be buried in the solder resist. A small via is drilled by laser drilling and plated filled with copper to be used as the connection between the circuits. By this way, the density and the flexibility of routing could be improved. A mesh pattern can be made in the limited space to increase the stiffness of the substrate.