The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 15, 2005
Filed:
Sep. 27, 2002
Chang-han Yun, Boston, MA (US);
Lawrence E. Felton, Hopkinton, MA (US);
Maurice S. Karpman, Brookline, MA (US);
John A. Yasaitis, Lexington, MA (US);
Michael W. Judy, Wakefield, MA (US);
Colin Gormley, Belfast, GB;
Chang-Han Yun, Boston, MA (US);
Lawrence E. Felton, Hopkinton, MA (US);
Maurice S. Karpman, Brookline, MA (US);
John A. Yasaitis, Lexington, MA (US);
Michael W. Judy, Wakefield, MA (US);
Colin Gormley, Belfast, GB;
Analog Devices, Inc., Norwood, MA (US);
Abstract
A flip-bonding technique is used to fabricate complex micro-electromechanical systems. Various micromachined structures are fabricated on the front side of each of two wafers. One of the wafers is flipped over and bonded to the other wafer so that the front sides of the two wafers are bonded together in a flip-stacked configuration.