The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 6953391 B1

PDF
Full Text
Expired
Date of Patent:
Oct. 11, 2005

Filed:

Jul. 28, 2004
Applicants:

Sabir A. Majumder, Fremont, CA (US);

Cangshan Xu, Fremont, CA (US);

Zhefei Chen, Los Altos, CA (US);

Inventors:

Sabir A. Majumder, Fremont, CA (US);

Cangshan Xu, Fremont, CA (US);

Zhefei Chen, Los Altos, CA (US);

Assignee:

Lam Research Corporation, Fremont, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B24B001/00 ;
U.S. Cl.
CPC ...
Abstract

Methods for dispensing slurry in a linear chemical mechanical planarization (CMP) system are provided. One method involves the use of a pulsing flow of slurry instead of a continuous flow of slurry. Another method involves spraying a mist of slurry onto the polishing pad. Yet another method involves controlling the gap between the nozzles from which the slurry is dispensed and the top surface of the polishing pad. Each of these methods reduces the amount of slurry used during a CMP operation.


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