The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 20, 2005
Filed:
Oct. 30, 2003
Tomoe Miyazawa, Funabashi, JP;
Yoichiro Fujita, Funabashi, JP;
Ichiro Kobayashi, Chiyoda-ku, JP;
Nissan Chemical Indusries, Ltd., Tokyo, JP;
Abstract
A semiconductor wafer cleaning formulation for use in semiconductor fabrication comprising maleic acid and ethylene urea as essential components. The preferred formulation comprises maleic acid, ethylene urea, at least one carboxylic acid except maleic acid, at least one organic amine except ethylene urea and water. The formulation can optionally comprise at least one selected from the group consisting of an organic solvent, a chelating agent and a surfactant. The formulation is suitably used for removal of residue from semiconductor wafers following a resist ashing process, particularly for removal of residue from wafers containing delicate copper interconnect and low-k or ultra low-k interlayer dielectrics structures. There is also provided a method for cleaning the wafer by using the formulation.