The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 06, 2005
Filed:
Dec. 03, 2003
Naoki Shibata, Bisai, JP;
Jun Ito, Inazawa, JP;
Toshiaki Chiyo, Ama-gun, JP;
Shizuyo Asami, Inazawa, JP;
Hiroshi Watanabe, Ichinomiya, JP;
Masanobu Senda, Niwa-gun, JP;
Shinya Asami, Inazawa, JP;
Naoki Shibata, Bisai, JP;
Jun Ito, Inazawa, JP;
Toshiaki Chiyo, Ama-gun, JP;
Shizuyo Asami, Inazawa, JP;
Hiroshi Watanabe, Ichinomiya, JP;
Masanobu Senda, Niwa-gun, JP;
Shinya Asami, Inazawa, JP;
Toyoda Gosei Co., Ltd., Aichi, JP;
Abstract
A first group III nitride compound layer, which is formed on a substrate by a method not using metal organic compounds as raw materials, is heated in an atmosphere of a mixture gas containing a hydrogen or nitrogen gas and an ammonia gas, so that the crystallinity of a second group III nitride compound semiconductor layer formed on the first group III nitride compound layer is improved. When the first group III nitride compound layer is formed on a substrate by a sputtering method, the thickness of the first group III nitride compound layer is set to be in a range of from 50 Å to 3000 Å.