The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 06, 2005
Filed:
Jan. 22, 2001
Kenji Kamimura, Tokyo, JP;
Norio Kimura, Tokyo, JP;
Satoshi Okamura, Tokyo, JP;
Hideo Aizawa, Tokyo, JP;
Makoto Akagi, Tokyo, JP;
Katsuhiko Tokushige, Tokyo, JP;
Hisanori Matsuo, Tokyo, JP;
Manabu Tsujimura, Tokyo, JP;
Kenji Kamimura, Tokyo, JP;
Norio Kimura, Tokyo, JP;
Satoshi Okamura, Tokyo, JP;
Hideo Aizawa, Tokyo, JP;
Makoto Akagi, Tokyo, JP;
Katsuhiko Tokushige, Tokyo, JP;
Hisanori Matsuo, Tokyo, JP;
Manabu Tsujimura, Tokyo, JP;
Ebara Corporation, Tokyo, JP;
Abstract
The present invention relates to a polishing apparatus for polishing a workpiece, such as a semiconductor wafer, to a flat mirror finish. The polishing apparatus comprises a polishing table having a polishing surface, and a top ring, and the workpiece is interposed between the polishing table and the top ring, and pressed at a predetermined pressure to polish the workpiece. The polishing apparatus comprises at least two dressing units for dressing the polishing surface by being brought into contact with the ppolishing surface, which is a surface of a polishing cloth.