The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 30, 2005
Filed:
Oct. 29, 2002
Yasuhiro Sugaya, Osaka, JP;
Shingo Komatsu, Kadoma, JP;
Koichi Hirano, Hirakata, JP;
Seiichi Nakatani, Hirakata, JP;
Yasuyuki Matsuoka, Neyagawa, JP;
Toshiyuki Asahi, Osaka, JP;
Yoshihisa Yamashita, Kyoto, JP;
Yasuhiro Sugaya, Osaka, JP;
Shingo Komatsu, Kadoma, JP;
Koichi Hirano, Hirakata, JP;
Seiichi Nakatani, Hirakata, JP;
Yasuyuki Matsuoka, Neyagawa, JP;
Toshiyuki Asahi, Osaka, JP;
Yoshihisa Yamashita, Kyoto, JP;
Matsushita Electric Industrial Co., Ltd., Osaka, JP;
Abstract
A transfer material capable of transferring a fine wiring pattern to a substrate reliably and easily. The transfer material includes at least three layers of a first metal layer as a carrier, a second metal layer that is transferred to the substrate as a wiring pattern, and a peel layer adhering the first and second metal layers releasably. On the surface portion of the first metal layer, a concave and convex portion corresponding to the wiring pattern is formed, and the peel layer and the second metal layer are formed on a region of the convex portions.