The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 23, 2005
Filed:
Sep. 15, 2003
Chu-chung Lee, Round Rock, TX (US);
Fuaida Harun, Selangor, MY;
Kevin J. Hess, Austin, TX (US);
Lan Chu Tan, Selangor, MY;
Cheng Choi Yong, Selangor, MY;
Chu-Chung Lee, Round Rock, TX (US);
Fuaida Harun, Selangor, MY;
Kevin J. Hess, Austin, TX (US);
Lan Chu Tan, Selangor, MY;
Cheng Choi Yong, Selangor, MY;
Freescale Semiconductor, Inc., Austin, TX (US);
Abstract
An integrated circuit die () has a copper contact (), which, upon exposure to the ambient air, forms a native copper oxide. An organic material is applied to the copper contact which reacts with the native copper oxide to form an organic coating () on the copper contact in order to prevent further copper oxidation. In this manner, further processing at higher temperatures, such as those greater than 100 degrees Celsius, is not inhibited by excessive copper oxidation. For example, due to the organic coating, the high temperature of the wire bond process does not result in excessive oxidation which would prevent reliable wire bonding. Thus, the formation of the organic coating allows for a reliable and thermal resistance wire bond (). Alternatively, the organic coating can be formed over exposed copper at any time during the formation of the integrated circuit die to prevent or limit the formation of copper oxidation.