The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 09, 2005

Filed:

Mar. 14, 2000
Applicants:

Akihiro Yaguchi, Tsuchiura, JP;

Hideo Miura, Tsuchiura, JP;

Atsushi Kazama, Tsuchiura, JP;

Asao Nishimura, Kodaira, JP;

Inventors:

Akihiro Yaguchi, Tsuchiura, JP;

Hideo Miura, Tsuchiura, JP;

Atsushi Kazama, Tsuchiura, JP;

Asao Nishimura, Kodaira, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L023/48 ; H01L023/52 ; H01L029/40 ;
U.S. Cl.
CPC ...
Abstract

In a small semiconductor device having external terminals on a semiconductor element and a semiconductor module mounted with the small semiconductor device, disconnection of the external terminals is prevented when a temperature change occurs under the conditions that the semiconductor device is mounted on a printed circuit board. To achieve this a projection is formed on a land which is an external terminal bonding area of the semiconductor device, and a protruded portion of the projection is bonded to the external terminal. An intervening portion of a protective film made of resin material is formed between the lands and semiconductor element.


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