The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 6926590 B1

PDF
Full Text
Expired
Date of Patent:
Aug. 09, 2005

Filed:

Jun. 25, 2004
Applicants:

Kuo Hui Chang, Taoyuan, TW;

Shing Long Lee, Hsinchu, TW;

Ching Lang Yen, Taichung, TW;

Inventors:

Kuo Hui Chang, Taoyuan, TW;

Shing Long Lee, Hsinchu, TW;

Ching Lang Yen, Taichung, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L021/00 ;
U.S. Cl.
CPC ...
Abstract

A method of improving the yield and performance of IC devices fabricated on a semiconductor wafer is disclosed. The method includes fabricating via plugs in via openings provided in an intermetal dielectric (IMD) layer on a wafer, subjecting the wafer to CMP to isolate the via plugs, immersing and soaking the wafer in deionized (DI) water, and drying the wafer using isopropyl alcohol, typically in a Marangoni-type dryer. The Marangoni IPA drying step prevents the formation of static electricity on the wafer, and thus, prevents the adherence of small charged particles to the wafer. As a result, the yield of IC devices fabricated on the wafer, as well as the performance of the devices, is enhanced.


Find Patent Forward Citations

Chang, Kuo. (2005). Method of improving device performance (U.S. Patent No. 6926590). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6926590

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