The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 02, 2005

Filed:

Jun. 16, 2003
Applicants:

Peter G. Tolchinsky, Beaverton, OR (US);

Irwin Yablok, Portland, OR (US);

Inventors:

Peter G. Tolchinsky, Beaverton, OR (US);

Irwin Yablok, Portland, OR (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L029/72 ;
U.S. Cl.
CPC ...
Abstract

A method and apparatus for a semiconductor device having increased electrical carrier mobility is described. That method and apparatus comprises forming two recesses within a substrate, and providing a material within the two recesses. The material has a predetermined coefficient of thermal expansion (CTE) to facilitate introduction of a predetermined strain within the substrate in a location between the two recesses. Also described is a semiconductor device that comprises a substrate having two recesses formed therein, and a material disposed within the two recesses. The material has a predetermined coefficient of thermal expansion (CTE) to facilitate introduction of a predetermined strain within the substrate in a location between the two recesses.


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