The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 02, 2005
Filed:
Sep. 03, 2002
Applicants:
Ja-hyung Han, Suwon-si, KR;
Sang-rok Hah, Seoul, KR;
Hong-seong Son, Suwon-si, KR;
Duk-ho Hong, Goyang-si, KR;
Byung-lyul Park, Seoul, KR;
Inventors:
Ja-Hyung Han, Suwon-si, KR;
Sang-Rok Hah, Seoul, KR;
Hong-Seong Son, Suwon-si, KR;
Duk-Ho Hong, Goyang-si, KR;
Byung-Lyul Park, Seoul, KR;
Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L021/44 ; H01L021/302 ;
U.S. Cl.
CPC ...
Abstract
In a method and apparatus for polishing a Cu metal layer and a method for forming Cu metal wiring, Cu oxide created by a surface oxidation of a Cu metal layer is removed from the wafer. The Cu metal layer, in which Cu oxide is removed, is polished. By polishing the Cu metal layer using the above method, process failures, such as scratches, caused by the presence of remnants of Cu oxide during subsequent polishing can be prevented.