The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 6921706 B1

PDF
Full Text
Expired
Date of Patent:
Jul. 26, 2005

Filed:

Feb. 06, 2004
Applicants:

Gregory M. Chrysler, Chandler, AZ (US);

Abhay A. Watwe, Chandler, AZ (US);

Sairam Agraharam, Phoenix, AZ (US);

Kramadhati V. Ravi, Atherton, CA (US);

Michael C. Garner, Pleasanton, CA (US);

Inventors:

Gregory M. Chrysler, Chandler, AZ (US);

Abhay A. Watwe, Chandler, AZ (US);

Sairam Agraharam, Phoenix, AZ (US);

Kramadhati V. Ravi, Atherton, CA (US);

Michael C. Garner, Pleasanton, CA (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L021/46 ; H01L021/78 ; H01L021/301 ;
U.S. Cl.
CPC ...
Abstract

Processes are described whereby a wafer is manufactured, a die from the wafer, and an electronic assembly including the die. The die has a diamond layer which primarily serves to spread heat from hot spots of an integrated circuit in the die.


Find Patent Forward Citations

Chrysler, Gregory. (2005). Electronic assembly including a die having an integrated circuit and a layer of diamond to transfer heat (U.S. Patent No. 6921706). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6921706

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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