The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 12, 2005

Filed:

Aug. 29, 2002
Applicants:

William R. Stephenson, Nampa, ID (US);

Bret K. Street, Meridian, ID (US);

Todd O. Bolken, Meridian, ID (US);

Inventors:

William R. Stephenson, Nampa, ID (US);

Bret K. Street, Meridian, ID (US);

Todd O. Bolken, Meridian, ID (US);

Assignee:

Micron Technology, Inc., Boise, ID (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L021/48 ;
U.S. Cl.
CPC ...
Abstract

A method and apparatus for encapsulating a BGA package. Specifically, a BGA package is encapsulated after the balls are attached to the package. The backside of the package having the balls disposed thereon may be completely covered by the encapsulant. The encapsulant is disposed in direct contact about a portion of the balls. A liner is provided to facilitate the formation of an unencapsulated portion of each ball. The unencapsulated portion may be used to couple the package to a system.


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