The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 05, 2005
Filed:
Sep. 14, 2001
Ralph Albano, Columbia, MD (US);
Cory Bargeron, Midland, MI (US);
Ivan L. Berry, Iii, Ellicott City, MD (US);
Jeff Bremmer, Midland, MI (US);
Phil Dembowski, Midland, MI (US);
Orlando Escorcia, Falls Church, VA (US);
Qingyuan Han, Columbia, MD (US);
Nick Sbrockey, Gaithersburg, MD (US);
Carlo Waldfried, Falls Church, VA (US);
Ralph Albano, Columbia, MD (US);
Cory Bargeron, Midland, MI (US);
Ivan L. Berry, III, Ellicott City, MD (US);
Jeff Bremmer, Midland, MI (US);
Phil Dembowski, Midland, MI (US);
Orlando Escorcia, Falls Church, VA (US);
Qingyuan Han, Columbia, MD (US);
Nick Sbrockey, Gaithersburg, MD (US);
Carlo Waldfried, Falls Church, VA (US);
Axcelis Technologies, Inc., Beverly, MA (US);
Dow Corning Corporation, Midland, MI (US);
Abstract
Low dielectric constant porous materials with improved elastic modulus and hardness. The process of making such porous materials involves providing a porous dielectric material and plasma curing the porous dielectric material to produce a plasma cured porous dielectric material. Plasma curing of the porous dielectric material yields a material with improved modulus and hardness. The improvement in elastic modulus is typically greater than or about 50%, more typically greater than or about 100%, and more typically greater than or about 200%. The improvement in hardness is typically greater than or about 50%. The plasma cured porous dielectric material can optionally be post-plasma treated. The post-plasma treatment of the plasma cured porous dielectric material reduces the dielectric constant of the material while maintaining an improved elastic modulus and hardness as compared to the plasma cured porous dielectric material. The post-plasma treated, plasma cured porous dielectric material has a dielectric constant between about 1.1 and about 3.5 and an improved elastic modulus and hardness.