The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 28, 2005
Filed:
Jun. 21, 2002
Tze-liang Lee, Hsinchu, TW;
Chao-chen Chen, Matou, TW;
Tze-Liang Lee, Hsinchu, TW;
Chao-Chen Chen, Matou, TW;
Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;
Abstract
A new process flow is provided for the creation of a fuse contact and a bond pad. The invention starts with a semiconductor substrate over the surface of which is provided top level metal and fuse metal in the surface of a layer of insulation deposited over the surface of the substrate. A first etch stop layer is deposited over the surface of the layer of insulation over which a first passivation layer is deposited, an opening is created through these layers exposing the top level metal. A metal plug is created overlying the exposed surface of the top level metal. A stack of a patterned and etched hard mask layers, having been deposited at part of the creation of the metal plug and overlying a layer of metal plug material, remains in place over the surface of the created metal plug. A second layer of passivation material is deposited, the second layer of passivation is patterned and etched exposing the surface of the first layer of passivation overlying the fuse metal and exposing the surface of the stack of hard mask layers overlying the created metal plug. The stack of hard mask layers is then removed from the surface of the metal plug, exposing the surface of the metal plug to serve as a contact pad and further reducing the thickness of the first layer of passivation over the surface of the fuse metal, making the fuse more accessible for fuse blowing.