The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 28, 2005

Filed:

Jan. 10, 2003
Applicants:

Artur Kolics, San Jose, CA (US);

Nicolai Petrov, Santa Clara, CA (US);

Chiu Ting, Saratoga, CA (US);

Igor C. Ivanov, Dublin, CA (US);

Inventors:

Artur Kolics, San Jose, CA (US);

Nicolai Petrov, Santa Clara, CA (US);

Chiu Ting, Saratoga, CA (US);

Igor C. Ivanov, Dublin, CA (US);

Assignee:

Blue29, LLC, Sunnyvale, CA (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
C23C018/50 ; C23C018/52 ;
U.S. Cl.
CPC ...
Abstract

An electroless deposition solution of the invention for forming an alkali-metal-free coating on a substrate comprises a first-metal ion source for producing first-metal ions, a pH adjuster in the form of a hydroxide for adjusting the pH of the solution, a reducing agent, which reduces the first-metal ions into the first metal on the substrate, a complexing agent for keeping the first-metal ions in the solution, and a source of ions of a second element for generation of second-metal ions that improve the corrosion resistance of the aforementioned coating. The method of the invention consists of the following steps: preparing hydroxides of a metal such as Ni and Co by means of a complexing reaction, in which solutions of hydroxides of Ni and Co are obtained by displacing hydroxyl ions OHbeyond the external boundary of ligands of mono- or polydental complexants; preparing a complex composition based on a tungsten oxide WOor a phosphorous tungstic acid, such as H[P(WO)], as well as on the use of tungsten compounds for improving anti-corrosive properties of the deposited films; mixing the aforementioned solutions of salts of Co, Ni, or W and maintaining under a temperatures within the range of 20° C. to 100° C.; and carrying out deposition from the obtained mixed solution.


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