The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 07, 2005
Filed:
Sep. 11, 2000
Motohide Takeichi, Kanuma, JP;
Hiroyuki Fujihira, Kanuma, JP;
Motohide Takeichi, Kanuma, JP;
Hiroyuki Fujihira, Kanuma, JP;
Sony Chemicals Corporation, Tokyo, JP;
Abstract
A chip-on-glass (COG) assembly, in which the electrodes of the semiconductor chips () are held in direct connection with the corresponding electrodes on the substrate glass circuit board (), utilizes a layer () of a connecting material for bonding and connecting the semiconductor chip () with the substrate board (). The connecting material can provide a reduced stress concentration at the boundaries between the binder layer () and the chip () and between the binder layer () and the glass board (), even at higher adhesive strengths, bringing about less deformation, such as warping, of the resulting bonded assembly, even when using a thinner substrate glass board, and provides a superior bonding strength and excellent electroconductive performance. The connecting material is made up of, on the one hand, an adhesive component () containing a thermosetting resin and, on the other hand, electroconductive particles () and has a characteristic feature that a tensile elongation percentage at 25° C., after having been cured, is at least 5%.