The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 07, 2005
Filed:
Oct. 29, 2003
Applicants:
Bernd Goller, Otterfing, DE;
Robert-christian Hagen, Sarching, DE;
Christian Stuempfl, Schwandorf, DE;
Stefan Wein, Lappersdorf, DE;
Holger Woerner, Regensburg, DE;
Inventors:
Bernd Goller, Otterfing, DE;
Robert-Christian Hagen, Sarching, DE;
Christian Stuempfl, Schwandorf, DE;
Stefan Wein, Lappersdorf, DE;
Holger Woerner, Regensburg, DE;
Assignee:
Infineon Technologies AG, Munich, DE;
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L021/44 ; H01L021/48 ;
U.S. Cl.
CPC ...
Abstract
An electronic device has, as a multichip module, two or more semiconductor chips that are integrated into a leadframe such that a placement side of the leadframe and the active top sides of the circuit chips are flush and have a common fine wiring plane. The leadframe is arranged as an expanded semiconductor chip on a rewiring substrate.