The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 31, 2005

Filed:

May. 14, 2003
Applicants:

Naoyuki Tamura, Kudamatsu, JP;

Kazue Takahashi, Kudamatsu, JP;

Youichi Ito, Kudamatsu, JP;

Yoshifumi Ogawa, Kudamatsu, JP;

Hiroyuki Shichida, Kudamatsu, JP;

Tsunehiko Tsubone, Hikari, JP;

Inventors:

Naoyuki Tamura, Kudamatsu, JP;

Kazue Takahashi, Kudamatsu, JP;

Youichi Ito, Kudamatsu, JP;

Yoshifumi Ogawa, Kudamatsu, JP;

Hiroyuki Shichida, Kudamatsu, JP;

Tsunehiko Tsubone, Hikari, JP;

Assignee:

Hitachi, Ltd., Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05H001/00 ; C23C016/00 ; C23F001/00 ;
U.S. Cl.
CPC ...
Abstract

A method and system of holding a substrate to decrease foreign substances on the back surface thereof. The substrate holding system includes a ring-shaped leakage-proof surface having a smooth surface on the specimen table corresponding to the periphery of the substrate, contact holding portions within the periphery of the substrate, and electrostatic attraction means for fixing the substrate by contacting the back surface thereof to the ring-shaped leakage-proof surface and the contact holding portions. The substrate contacts a cooling surface at the ring-shaped leakage-proof surface and the contact holding portion placed on a position inside the ring-shaped leakage-proof surface. The back surface of the substrate and the cooling surface do not contact each other in the large portion of the remaining area.


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