The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 17, 2005
Filed:
Apr. 30, 2001
Applicants:
Quat T. VU, Santa Clara, CA (US);
Tuy T. Ton, San Jose, CA (US);
Steven Towle, Phoenix, AZ (US);
Inventors:
Assignee:
Intel Corporation, Santa Clara, CA (US);
Primary Examiner:
Int. Cl.
CPC ...
H01L023/48 ; H01L023/52 ; H01L029/40 ;
U.S. Cl.
CPC ...
Abstract
A microelectronic device includes a microelectronic die having an interfacial metal layer deposited over an active surface thereof to perform a signal distribution function within the device. The microelectronic die is fixed within a package core to form a die/core assembly. One or more metallization layers may then be built up over the die/core assembly as part of a packaging scheme. The interfacial metal layer can be applied either before or after the die is fixed within the package core. In one approach, the interfacial layer is applied during wafer-level processing.