The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 03, 2005
Filed:
Jun. 26, 2003
Applicants:
Takeru Matsuoka, Tokyo, JP;
Noriaki Fujiki, Tokyo, JP;
Hiroki Takewaka, Tokyo, JP;
Inventors:
Assignee:
Renesas Technology Corp., Tokyo, JP;
Primary Examiner:
Int. Cl.
CPC ...
H01L023/48 ; H01L023/52 ; H01L029/40 ;
U.S. Cl.
CPC ...
Abstract
A contact and a copper interconnect line as an uppermost interconnect layer are buried in an interlayer insulating film. A pad area including aluminum alloy (such as AlCu or AlSiCu) is buried in a predetermined area of the copper interconnect line. A gold wire is bonded to the pad area.
Matsuoka, Takeru. (2005). Semiconductor device including copper interconnect line and bonding pad, and method of manufacturing the same (U.S. Patent No. 6888258). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6888258
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile