The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 03, 2005
Filed:
Apr. 15, 2003
Tadatomo Suga, Tokyo, JP;
Keisuke Saito, Yokohama, JP;
Rikiya Kato, Souka, JP;
Sakie Yamagata, Souka, JP;
Tadatomo Suga, Tokyo, JP;
Keisuke Saito, Yokohama, JP;
Rikiya Kato, Souka, JP;
Sakie Yamagata, Souka, JP;
Senju Metal Industry Co., Ltd., Tokyo, JP;
Abstract
A residue-free solder paste which leaves little or no flux residue after reflow soldering and which have good printability, storage stability, retainability of parts, and wettability, comprises a solder powder mixed with a rosin-free pasty flux. The flux comprises at least one solid solvent and at least one highly viscous solvent in a total amount of 30-90 mass %, in addition to at least one liquid solvent, all the solvents vaporizing at a reflow soldering temperature. The flux may further contain 0.5-12% of a thixotropic agent such as a fatty acid amide and 1-15% of an activator selected from organic acids and their amine salts, the thixotropic agent and activator vaporizing in the presence of the solvents while the solvents are vaporizing.