The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 12, 2005
Filed:
Mar. 30, 2000
Paride Corbellini, Trecate, IT;
Giovanni Negri, Sizzano, IT;
Ezio Bovio, Bellinzago Novarese, IT;
Luca Moiraghi, Milan, IT;
Paride Corbellini, Trecate, IT;
Giovanni Negri, Sizzano, IT;
Ezio Bovio, Bellinzago Novarese, IT;
Luca Moiraghi, Milan, IT;
MEMC Electronic Materials, SpA, Novara, IT;
Abstract
The method comprises the steps of mounting a first wafer () on the mounting member () and securing the mounting member to the hub () by drawing a vacuum at a first vacuum pressure through the hub; rotating the hub about the hub axis (AH), rotating a polishing pad () mounted on the turntable () about the turntable axis (at), and bringing a surface of the wafer () and the polishing pad into contact with each other. The wafer () is demounted, and the shape of the polished wafer is determined. A second vacuum pressure is selected using the information obtained. A successive wafer is polished according to the same method as the first wafer except that the second vacuum pressure is substituted for the first vacuum pressure. The second vacuum pressure is sufficient to deform the mounting member () thereby deform the wafer to improve the flatness and parallelism of the surfaces of the successive wafer.