The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 05, 2005
Filed:
Oct. 01, 2002
Hideo Miura, Koshigaya, JP;
Ryuji Kohno, Chiyoda, JP;
Hideo Miura, Koshigaya, JP;
Ryuji Kohno, Chiyoda, JP;
Renesas Technology Corp., Tokyo, JP;
Abstract
A semiconductor device superior in heat dissipation in which the exchanging of chips can be readily performed is realized by mounting, through means distinct from bonding or connecting, a LSI chip on an interconnection substrate having substantially no difference in thermal conductivity between the LSI chip and the substrate. The semiconductor device is provided on an interconnection substratewith electrode terminalsof cantilever structure, an interconnection layerfor electrical connection among the electrode terminals, an interconnection layerfor electrical connection to outer portions, and fitting portionsformed in a cover, the substrateand the coverbeing connected by the fitting portions. The chipsandare electrically contacted through the terminalswithout using any bonding or connecting, so that the mounting and detachment of the coverand the substrate can be readily performed.