The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 05, 2005

Filed:

Jun. 21, 2002
Applicants:

Nanhai LI, San Jose, CA (US);

Nicolai Petrov, San Jose, CA (US);

Artur Kolics, San Jose, CA (US);

Inventors:

Nanhai Li, San Jose, CA (US);

Nicolai Petrov, San Jose, CA (US);

Artur Kolics, San Jose, CA (US);

Assignee:

Mattson Technology, Inc., Fremont, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L021/44 ;
U.S. Cl.
CPC ...
Abstract

A sequence of temperature control in electroless plating for microelectronic processing is disclosed in this invention. This sequence improves the uniformity of the deposit, increases the lifetime of the plating bath and is cost effective. The plating bath is heated to a temperature, which is lower than the minimum deposition temperature, in an apparatus outside the plating chamber. Then the solution is introduced into the plating chamber without the occurrence of the deposition. After the chamber is filled, the solution is heated up to the desired deposition temperature. The deposition is initialized. After the deposition, the solution is returned back to the original tank.


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