The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 05, 2005
Filed:
Jan. 05, 2001
Tsutomu Takahashi, Iwaki, JP;
Naoki Shimomae, Iwaki, JP;
Hanako Hata, Iwaki, JP;
Mitsubishi Materials Corporation, Tokyo, JP;
Abstract
Objectives: To improve the cutting sharpness and life while the manufacturing cost is being lowered. Solution mechanism: The whetstone particle layer (), which consists of multiple whetstone particle layer units (), . . . , is configured on the surface () of the whetstone substrate () while the respective whetstone particle layer units () are being mutually linked via the bridge unit (). The non-whetstone particle unit () is configured between whetstone particle layer units () and (). Whetstone particle layer unit () is obtained by configuring the superwhetstone particles () densely in the central unit () and by configuring them sparsely in the peripheral unit (). The metal coupling phase (), to which the superwhetstone particles () are fixed, is formed by the first and second metal plate phases () and (), respectively. The thickness of the first metal plate phase () decreases from the central unit () toward the peripheral unit () in the shape of a mountain.