The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 6875091 B1

PDF
Full Text
Expired
Date of Patent:
Apr. 05, 2005

Filed:

Feb. 28, 2001
Applicants:

Allan M. Radman, Aptos, CA (US);

Alan J. Jensen, Troutdale, OR (US);

Helmuth Treichel, Milpitas, CA (US);

Robert G. Boehm, Alameda, CA (US);

Michael S. Lacy, Pleasanton, CA (US);

Eric A. Dunton, Garland, TX (US);

Inventors:

Allan M. Radman, Aptos, CA (US);

Alan J. Jensen, Troutdale, OR (US);

Helmuth Treichel, Milpitas, CA (US);

Robert G. Boehm, Alameda, CA (US);

Michael S. Lacy, Pleasanton, CA (US);

Eric A. Dunton, Garland, TX (US);

Assignee:

Lam Research Corporation, Fremont, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B24B053/07 ;
U.S. Cl.
CPC ...
Abstract

A method and apparatus for conditioning a polishing pad is described, wherein the polishing pad has a polishing surface for polishing the semiconductor wafer. The method includes positioning a sonic energy generator above the polishing surface of the polishing pad, and applying sonic energy to the polishing surface of the polishing pad. The apparatus a sonic energy generator adapted to be positioned above the polishing surface, the sonic energy generator including a transducer, and a liquid carrier in flow communication with the transducer, wherein the transducer transmits sonic energy into the liquid carrier and the liquid carrier is applied to the polishing surface of the polishing belt.


Find Patent Forward Citations

Loading…