The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 22, 2005

Filed:

Mar. 08, 2001
Applicants:

Thomas P. Glenn, Gilbert, AZ (US);

Roy Dale Hollaway, Chandler, AZ (US);

Steven Webster, Chandler, AZ (US);

Inventors:

Thomas P. Glenn, Gilbert, AZ (US);

Roy Dale Hollaway, Chandler, AZ (US);

Steven Webster, Chandler, AZ (US);

Assignee:

Amkor Technology, Inc., Chandler, AZ (US);

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L021/301 ;
U.S. Cl.
CPC ...
Abstract

A wafer includes a vertical scribe line and a horizontal scribe line on a front-side surface of the wafer. An intersection of the vertical scribe line and the horizontal scribe line is optically recognized through a wafer support attached to the front-side surface of the wafer. The wafer is drilled all the way through at the intersection to form a back-side alignment mark on a back-side surface of said wafer. The back-side alignment mark is used to aligning a saw, which singulates the wafer from the back-side surface.


Find Patent Forward Citations

Glenn, Thomas. (2005). Back-side wafer singulation method (U.S. Patent No. 6869861). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6869861

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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