The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 15, 2005
Filed:
Apr. 30, 2002
Gerald Friese, Munich, DE;
Werner K. Robl, Poughkeepsie, NY (US);
Hans-joachim Barth, Munich, DE;
Axel Brintzinger, Dresden, DE;
Gerald Friese, Munich, DE;
Werner K. Robl, Poughkeepsie, NY (US);
Hans-Joachim Barth, Munich, DE;
Axel Brintzinger, Dresden, DE;
Infineon Technologies AG, Munich, DE;
Abstract
A bond pad structure formed over a predetermined area of an IC substrate comprising quickly and easily removable redundancy and passivation layers upon lithography and plasma etching in a plasma containing Cl, the bond structure comprises: a liner or lower metal layer formed on a predetermined area of the IC substrate; an aluminum-based metal layer formed on the liner layer as the last metal layer for bond purposes; a tungsten based redundancy layer formed on top of the aluminum-based last metal layer; and a passivation layer formed over the IC substrate and on the tungsten based redundancy layer.