The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 6863774 B1

PDF
Full Text
Expired
Date of Patent:
Mar. 08, 2005

Filed:

Mar. 01, 2002
Applicants:

Richard D. Cooper, Sullivan, IN (US);

Paul Fathauer, Sullivan, IN (US);

Angela Mroczek-petroski, Crawfordsville, IN (US);

David Perry, Crawfordsville, IN (US);

James J. Petroski, Crawfordsville, IN (US);

Inventors:

Richard D. Cooper, Sullivan, IN (US);

Paul Fathauer, Sullivan, IN (US);

Angela Mroczek-Petroski, Crawfordsville, IN (US);

David Perry, Crawfordsville, IN (US);

James J. Petroski, Crawfordsville, IN (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
D21H027/00 ;
U.S. Cl.
CPC ...
Abstract

A polishing pad for use in chemical mechanical polishing of substrates that being made of fibrous matrix such as cellulose with a binder consisting of thermoset resin material, such as phenolic resin. The polishing surface is ground to form asperities. The polishing pad provides a porous structure by which polishing slurry and polishing debris during chemical mechanical polishing of substrates are stored for subsequent rinsing away, and for enhanced flow-distribution of the polishing slurry. Also disclosed is a method of making the polishing pad.


Find Patent Forward Citations

Cooper, Richard. (2005). Polishing pad for use in chemical-mechanical planarization of semiconductor wafers and method of making same (U.S. Patent No. 6863774). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6863774

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