The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 01, 2005
Filed:
Oct. 09, 2002
Chok J. Chia, Cupertino, CA (US);
Qwai H. Low, Cupertino, CA (US);
Ramaswamy Ranganathan, Saratoga, CA (US);
Chok J. Chia, Cupertino, CA (US);
Qwai H. Low, Cupertino, CA (US);
Ramaswamy Ranganathan, Saratoga, CA (US);
Other;
Abstract
An integrated circuit having a top passivation layer and bonding pads, where the improvement is a metal layer overlying all of the integrated circuit. The metal layer overlies the top passivation layer and is not in electrical contact with any of the bonding pads. In this manner, there is a structure that is added to the integrated circuit which has a relatively high thermal conductivity, and which also has a relatively high structural strength. With these two added properties, the occurrence of stress cracks, such as those induced by plastic molded packages, is reduced, and hot spots tend to be dissipated. Thus, the overlying metal layer tends to improve the reliability of the integrated circuit.