The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 22, 2005
Filed:
Oct. 17, 2003
Jeong-heon Park, Suwon, KR;
Chang-ki Hong, Seoul, KR;
Jae-dong Lee, Suwon, KR;
Young-rae Park, Suwon, KR;
Ho-young Kim, Sungnam, KR;
Jeong-heon Park, Suwon, KR;
Chang-ki Hong, Seoul, KR;
Jae-dong Lee, Suwon, KR;
Young-rae Park, Suwon, KR;
Ho-Young Kim, Sungnam, KR;
Samsung Electronics Co., LTD, Kyungki-do, KR;
Abstract
A method for isolating SAC pads of a semiconductor device, including determining a chemical mechanical polishing process time necessary to isolate the SAC pads a desired amount by referring to a relationship equation between the extent of isolation of the self-aligned contact pads and the chemical-mechanical polishing process time. The chemical mechanical polishing process is performed for the determined process time on the semiconductor device to isolate the self-aligned contact pads the desired amount. The relationship equation is determined using a test semiconductor device.