The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 22, 2005

Filed:

Aug. 25, 2000
Applicants:

Jung-chih HU, Hsinchu, TW;

Wu-chun Gau, Hsinchu, TW;

Ting-chang Chang, Kaohsiung, TW;

Ming-shiann Feng, Hsinchu, TW;

Chun-lin Cheng, Jung Li Taur-Yuan, TW;

You-shin Lin, Su-Yuh Yi-Lan, TW;

Ying-hao LI, Taoyuan, TW;

Lih-juann Chen, Hsinchu, TW;

Inventors:

Jung-Chih Hu, Hsinchu, TW;

Wu-Chun Gau, Hsinchu, TW;

Ting-Chang Chang, Kaohsiung, TW;

Ming-Shiann Feng, Hsinchu, TW;

Chun-Lin Cheng, Jung Li Taur-Yuan, TW;

You-Shin Lin, Su-Yuh Yi-Lan, TW;

Ying-Hao Li, Taoyuan, TW;

Lih-Juann Chen, Hsinchu, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C25D003/38 ; C23C018/00 ;
U.S. Cl.
CPC ...
Abstract

The invention relates to a novel galvanizing solution for the galvanic deposition of copper. Hydroxylamine sulfate or hydroxylamine hydrochloride are utilized as addition reagents and added to the galvanizing solution during the galvanic deposition of copper which is used in the manufacture of semiconductors.


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