The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 22, 2005
Filed:
Jan. 17, 2003
Yuchun Wang, San Jose, CA (US);
Bernard M. Frey, Livermore, CA (US);
Bulent M. Basol, Manhattan Beach, CA (US);
Homayoun Talieh, San Jose, CA (US);
Douglas W. Young, Sunnyvale, CA (US);
Brett E. Mcgrath, San Jose, CA (US);
Mukesh Desai, Milpitas, CA (US);
Efrain Velazquez, Los Angeles, CA (US);
Tuan Truong, San Jose, CA (US);
Yuchun Wang, San Jose, CA (US);
Bernard M. Frey, Livermore, CA (US);
Bulent M. Basol, Manhattan Beach, CA (US);
Homayoun Talieh, San Jose, CA (US);
Douglas W. Young, Sunnyvale, CA (US);
Brett E. McGrath, San Jose, CA (US);
Mukesh Desai, Milpitas, CA (US);
Efrain Velazquez, Los Angeles, CA (US);
Tuan Truong, San Jose, CA (US);
ASM NuTool, Inc, Milpitas, CA (US);
Abstract
An apparatus for polishing a workpiece includes a workpiece holder configured to hold the workpiece, a polishing member configured to be positioned adjacent to a face of the workpiece in order to polish the workpiece face with a front side of the polishing member, and a platen having a plurality of pressure zones configured to selectively apply pressure to the polishing member thereby causing the polishing member to contact the workpiece face with selective pressure. In another embodiment, the apparatus includes a pressure controller coupled to the platen and configured to selectively adjust the pressure zones.