The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 15, 2005
Filed:
Jun. 20, 2003
Applicants:
Chen-ming Huang, Taipei, TW;
Sen-shan Yang, Tainan, TW;
Inventors:
Chen-Ming Huang, Taipei, TW;
Sen-Shan Yang, Tainan, TW;
Assignee:
Taiwan Semiconductor Manufacturing Co., Ltd., Hsin-Chu, TW;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L021/324 ;
U.S. Cl.
CPC ...
Abstract
A method for reducing stress migration in the copper interconnect line is set forth. In accordance with the method, two anneal steps take place: The first step is at low temperature and of relatively short duration (e.g., about 25-300° C., and about 10 seconds-10 hours). After the first anneal, the wafer is cooled to room temperature. The second step is performed after the cooling step; a higher anneal temperature and longer time duration is needed to enhance performance.