The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 01, 2005

Filed:

Nov. 15, 2000
Applicants:

Thomas P. Glenn, Gilbert, AZ (US);

Steven Webster, Chandler, AZ (US);

Roy Dale Hollaway, Chandler, AZ (US);

Inventors:

Thomas P. Glenn, Gilbert, AZ (US);

Steven Webster, Chandler, AZ (US);

Roy Dale Hollaway, Chandler, AZ (US);

Assignee:

Amkor Technology, Inc., Chandler, AZ (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 3100 ; H01L 310203 ; H01L 2302 ;
U.S. Cl.
CPC ...
Abstract

An image sensor package includes an image sensor having an active area and bond pads on a front surface of the image sensor. A window is mounted to the image sensor by flip chip bumps formed between the bond pads of the image sensor and interior traces on an interior surface of the window. The window has an area less than an area of the front surface of the image sensor. A bead is formed between the window and the front surface of the image sensor thus forming a sealed cavity in which the active area is located. The bead has sides coplanar with sides of the image sensor such that the image sensor package is chip size.


Find Patent Forward Citations

Glenn, Thomas. (2005). Flip chip on glass sensor package (U.S. Patent No. 6849916). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6849916

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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