The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 01, 2005
Filed:
Apr. 05, 2002
Applicant:
Steven P. Cooper, Battle Ground, WA (US);
Inventor:
Steven P. Cooper, Battle Ground, WA (US);
Assignee:
SEH America, Inc., Vancouver, WA (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21302 ; H01L 21461 ;
U.S. Cl.
CPC ...
Abstract
A method of polishing the surface of a semiconductor wafer such that the adherence of abrasive particles to the surface of the wafer is minimized, resulting in a semiconductor wafer having a reduced number of pits. The invented method has two stages. The first stage follows traditional polishing practice using chemical mechanical polishing. The second stage diverges from traditional practices and provides for a final polishing step or steps involving the polishing of the wafer with a polishing solution having no abrasive particles.