The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 01, 2005
Filed:
Dec. 19, 2003
Shao-chung HU, Taipei, TW;
Yu-ru Yang, I-Lan Hsien, TW;
Chien-chung Huang, Tai-Chung Hsien, TW;
Tzung-yu Hung, Tainan Hsien, TW;
Shao-Chung Hu, Taipei, TW;
Yu-Ru Yang, I-Lan Hsien, TW;
Chien-Chung Huang, Tai-Chung Hsien, TW;
Tzung-Yu Hung, Tainan Hsien, TW;
United Microelectronics Corp., Hsin-Chu, TW;
Abstract
A method of forming at least one wire on a substrate. The substrate includes at least one conductive region. An insulating layer is disposed on the substrate. At least one recess in the insulating layer exposes the conductive region. A barrier layer is formed on a surface of the insulating layer and the recess first. A continuous and uniform conductive layer is then formed on a surface of the barrier layer. A seed layer is thereafter formed on a surface of the conductive layer. Finally, a metal layer filling up the recess is formed on a surface of the seed layer.