The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 01, 2005

Filed:

Oct. 11, 2001
Applicants:

Brian S. Beaman, Apex, NC (US);

William L. Brodsky, Binghamton, NY (US);

James A. Busby, Vestal, NY (US);

Benson Chan, Vestal, NY (US);

Voya R. Markovich, Endwell, NY (US);

Charles H. Perry, Poughkeepsie, NY (US);

Inventors:

Brian S. Beaman, Apex, NC (US);

William L. Brodsky, Binghamton, NY (US);

James A. Busby, Vestal, NY (US);

Benson Chan, Vestal, NY (US);

Voya R. Markovich, Endwell, NY (US);

Charles H. Perry, Poughkeepsie, NY (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01R 1200 ;
U.S. Cl.
CPC ...
Abstract

A structure and method for electrically coupling two substrates (e.g., a printed wiring board and an electronic module). Initially, a dielectric core is provided. A conductive wiring is helically wound circumferentially around the dielectric core. Additionally, a dielectric jacket may be formed around the conductive wiring. The resultant conductive rod structure is cut axially along the length of the conductive rod to generate conductive buttons having end contacts. The end contacts of the conductive buttons may be used to electrically couple the two substrates at corresponding pads of the two substrates.


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