The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 01, 2005
Filed:
Mar. 28, 2002
Johanna M. Swan, Scottsdale, AZ (US);
Bala Natarajan, Phoenix, AZ (US);
Chien Chiang, Fremont, CA (US);
Greg Atwood, San Jose, CA (US);
Valluri R. Rao, Saratoga, CA (US);
Johanna M. Swan, Scottsdale, AZ (US);
Bala Natarajan, Phoenix, AZ (US);
Chien Chiang, Fremont, CA (US);
Greg Atwood, San Jose, CA (US);
Valluri R. Rao, Saratoga, CA (US);
Intel Corporation, Santa Clara, CA (US);
Abstract
An electronic assembly is assembled by stacking two or more integrated circuit dies on top of one another. Prior to singulation, an opening is laser-drilled into an upper die, and subsequently filled with a conductive member. The conductive member is located on a lower die and interconnects integrated circuits of the upper and lower dies. Laser-drilling allows for faster throughput when compared to, for example, etching, especially if a small number of openings has to be formed. The opening is laser-drilled from an upper surface of the upper die all the way through the die, which allows for the use of alignment marks on an upper surface of the upper die.