The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 11, 2005
Filed:
Apr. 26, 2002
Applicants:
Mitsuaki Katagiri, Nishitokyo, JP;
Yuji Shirai, Hamura, JP;
Yoshiyuki Kado, Hanakoganei, JP;
Inventors:
Assignee:
Renesas Technology Corp., Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 2940 ;
U.S. Cl.
CPC ...
Abstract
With respect to two types of chips to be mounted on a main surface of a package substrate, the ratio of chip area to the number of terminals of one chip and that of the other chip are compared with each other and the chip smaller in the ratio is mounted by the wire bonding method, while the chip larger in the ratio is mounted by the flip-chip method. It is possible to reduce the cost of manufacturing a multi-chip module wherein plural types of chips having different terminal pitches are mounted on a wiring substrate.