The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 11, 2005

Filed:

Apr. 28, 2003
Applicants:

Edward W. Jaeck, Phoenix, AZ (US);

Chia-pin Chiu, Tempe, AZ (US);

Inventors:

Edward W. Jaeck, Phoenix, AZ (US);

Chia-Pin Chiu, Tempe, AZ (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 2348 ; H01L 2334 ; H01L 2158 ; H05K 302 ; G05B 1500 ;
U.S. Cl.
CPC ...
Abstract

An electronic package is provided, having a flexible substrate, a first plurality of conductors, and a second plurality of conductors. The flexible substrate has first and second portions with a fold portion between the first and second portions, and is folded at the fold portion to position the second portion over the first portion. Each one of the first plurality of conductors runs from the first portion over the fold portion onto the second portion. Each one of the second plurality of conductors runs from the first portion onto the second portion without running over the fold portion.


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